IRPS 2008 Detailed Submission Directions

IRPS 2008 Detailed Submission Directions

If you have questions about your submission that are not answered below contact:

Tom Moore, Technical Program Chair, 2008 IRPS Omniprobe, Inc. 10410 Miller Road Dallas, TX 75238 USA	phone: +1 (214) 572-6800 Fax: +1 (214) 572-6801 e-mail: moore@omniprobe.com This email address is for correspondence only.
Submission of papers and/or questions after submission has been acknowledged should be sent to: technical.chair@irps.org

The work represented by your submission must be original and unpublished.

2008 IRPS SUBMISSION COVER SHEET

A cover sheet doc or pdf) is required for each submission. Items that should be on the cover sheet are:

PAPER TITLE;
AUTHOR's names, affiliations, addresses, phone/fax/email (in order);
the PRIMARY CONTACT (and secondary contact as applicable);
a 50-WORD ABSTRACT of your work;
the CATEGORY of submission, based on the topic areas addressed in the Call for Papers (e.g. Circuits, soft errors);
SUBMISSION TYPE: platform or poster preference
PUBLICITY RELEASE: do not object or object.

Extended Abstract (a.k.a. Summary)
(not applicable to late-news, full-manuscript, paper submission)

The summary is a maximum of two pages long, and should clearly and concisely state the specific results of your work, why it is important, and how it relates to prior work. The summary should include graphs, drawings, photographs, and key references as necessary within the two-page limit.

Abstracts will be accepted in either electronic (preferred) or paper (hard copy) format. The procedure to submit an abstract electronically has been simplified. You DO NOT need a serial number before you make your submission. Serial numbers will be assigned after submissions have been received and identified in submission confirmations. Send electronic submissions to technical.chair@irps.org. Please limit abstract file size to a maximum of 2MB. All submissions will be acknowledged within three weeks. If you do not receive acknowledgment of your submission, please contact the Technical Program Chair, Tom Moore mailto:moore@omniprobe.com.

Step-by-Step Procedure for Electronic Submission

Step 1: Prepare 2-page Electronic Abstract

Prepare your 2-page extended abstract for electronic submission. It is preferred that you use the word97 template provided. (For those not able to read word97 see the pdf for format guidelines and this pdf for the cover sheet requirements.)

You must use Microsoft Word, Adobe Acrobat PDF, or HTML format.
Choose fonts that are readily available for printing (e.g. Times New Roman, Arial, Symbol,Courier).
Embed all fonts: In Word97 this is done by File|Save As|Options|Embed TrueType Fonts.
Keep the line spacing (leading) between 10 and 12 points.
Use standard Margin settings: typically 1 inch but not less than 0.67 inch all around.
Choose a Paper Source of 8.5" x 11"

Step 2: Email Abstract

Submit your electronic abstract by mailing it to the technical.chair@irps.org preferrably as a single email attachment. That is, the cover page and two-page summary should be attached as one document.
Include in the email "Subject:" line "first author's last name" followed by "IRPS2008 Submission" (e.g. LastnameIRPS2008Submission).

Step 3: Acknowledgement & Check of pdf to be reviewed

Within two weeks after submission to the Technical Program Chair, an acknowledgment with the assigned serial number for your submission will be sent by email to you. The email will contain a pdf copy of your submission, as will be reviewed by the Technical Program Committee. It is the responsibility of the submitting author to examine the pdf copy to ensure that the pdf is accurate and free from any error introduced by document decoding. If errors are found, notify the Technical Program Chair, using technical.chair@irps.org immediately.

Topic Areas in Call for Papers

Below are the major categories listed in the latest Call for Papers. Please see this document for more information. If more than one category seems applicable for your work, choose the one that most applies.

Reliability in Extreme Environments
Nanotechnology Reliability

High-k gate dielectrics,
dual gate devices,
Low-k and Cu,
NBTI,
SOI,
NVM,
Product Reliability & Burn-in ,

Qualification Strategies ,
Circuits and Soft Error Upsets,
Assembly and Packaging,
Failure Analysis,
MEMS,
Device Dielectrics,
Interconnects

Transistor,
Foundry Reliability,
Process Induced Damage,
Device and Process,
ESD,
Latch-Up,
High Voltage Devices

Paper (hard copy) Abstract Submission

If you choose to submit your abstract in paper format, we require:

1 paper copy of your one-page COVER SHEET filled out with the applicable information using the first page of the template

and

1 paper copy of your two-page abstract to be sent via express mail.

Mail to:

Tom Moore, Technical Program Chair, 2008 IRPS
Omniprobe, Inc.
10410 Miller Road
Dallas, TX 75238, USA

phone: +1 (214) 572-6800
Fax: +1 (214) 572-6801

e-mail: technical.chair@irps.org