IEEE IRPS 2007 April 15 - 19, 2007 Phoenix, Arizona
Call for Papers and Call for Posters 2007 IRPS
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Technical Program Chair Contact
Information:Ronald Lacoe The Aerospace Corporation PO Box 92957, M/S M2-244 Los Angeles, CA 90009-2957 USA phone: +1 (310) 336-0118 Fax: +1 (310) 726-1311 email: Ronald.C.Lacoe@aero.org email for paper/poster submissions: technical.chair@irps.org |
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| AP | ASSEMBLY & PACKAGING | S. Sidharth | AMD | sidharth.sidharth@amd.com |
| CD | COMPOUND SEMICONDUCTORS | Brian Skromme | Arizona State University | skromme@asu.edu |
| DIE | DIELECTRICS | Ernest Wu | IBM | eywu@us.ibm.com |
| E&L | ESD & Latchup | Elyse Rosenbaum | University of Illinois | elyse@uiuc.edu |
| FA | FAILURE ANALYSIS | Steven Kasapi | Credence | steven_kasapi@credence.com |
| HK | High K | Michel Houssa | IMEC | houssa@imec.be |
| HVD | HIGH VOLTAGE DEVICES | Peter Moens | AMI | peter_moens@amis.com |
| ITC | INTERCONNECTS | Baozhen Li | IBM | lib@us.ibm.com |
| MEM | MICRO-ELECTRO MECHANICAL SYSTEMS | Danelle Tanner | Sandia | tannerdm@sandia.gov |
| MRY | MEMORY | Chandra Mouli | Micron | cmouli@micron.com |
| P&C | PRODUCT RELIABILITY & CIRCUIT | Walter Riordan | Intel | walter.riordan@intel.com |
| PIR | PROCESS INTEGRATION RELIABILITY | Sanjay Rangan | Intel | sanjay.rangan@intel.com |
| SER | SOFT ERRORS | Kenneth Rodbell | IBM | rodell@us.ibm.com |
| XTR | TRANSISTOR | Anand Krishnan | Texas Instruments | anandtk@ti.com |
| MEE | EXTREME ENVIRONMENTS | Donald Mayer | The Aerospace Corp. | donald.c.mayer@aero.org |
Technical Program Subcommittee Members Home Page (password protected)