43^rd Annual • April 17 – 21, 2005 • San Jose Marriott • San Jose, California

2005 IRPS Call for Papers and Call for Posters   pdf		Technical Program Chair Contact Information: Ed Cole Sandia National Laboratories 1515 Eubank SE.- Mail Stop 1081 Albuquerque, NM 87185, USA phone: +1 (505) 844-1421 Fax: +1 (505) 844-2991 email: coleei@sandia.gov email for paper/poster submissions: was: technical.chair@irps.org (now active for 2006)
Author's Checklist: Submission template right click/save to disk WORD doc pdf of the above template Submission deadline: October 8, 2004 Late Paper Submission Deadline: December 3, 2004 Acceptance Decision Letter Notification mailed (November 10, 2004) except for late paper submissions Accepted Submissions also sent email or fax notification on or shortly after (November 11, 2004) Detailed submission --> guidelines		Detailed Author Kit for Platform and Poster Presenters some of the following are highlights from the authorkit: IEEE copyright form Acrobat version right click to download Author/Presenter/Mentor Timeline Milestones to final camera-ready manuscripts (ing reviewing process) Draft to reviewers 1/10 Review from reviewers back to authors 1/24 All final camera-ready papers/posters publishing deadline: Feb. 14, 2005 Visuals Draft to session chair/reviewer 2/18 Back to presenter 3/3 Final presentation 3/19

The IRPS Technical Program committee is composed of experts in the field of reliability engineering and physics from industry, academia and government labs. The Program Committee is divided into sub-committees that review papers in specific submission categories. This year the sub-committees are:

Assistant to the Technical Program Chair Amr Haggag, Freescale, Amr.Haggag@freescale.com
Circuit & Product Reliability	Chair: Bill Abadeer, IBM abadeer@us.ibm.com
ESD	Chair: Gianluca Boselli, Texas Instruments g-boselli@ti.com
Failure Analysis	Chair: Dave Vallett, IBM dvallett@us.ibm.com
Silicon Transistors	Chair: Anand Krishnan, TI anandtk@ti.com
Device Dielectrics	Chair: Masaaki Niwa, Panasonic/IMEC, niwama@imec.be
Backend Dielectrics	Chair: Amit Marathe, AMDamit.marathe@amd.com
Assembly and Packaging	Chair: Jeff Coffin, IBM, jcoffin@us.ibm.com
SER/SEU	Chair: Norbert Seifert, Intel, norbert.seifert@intel.com
Memories	Chair: Guoqiao Tao, Philips Semiconductor, guoqiao.tao@philips.com
Interconnects	Chair: Ennis Ogawa, Texas Instruments, e-ogawa1@ti.com
Wide Bandgap/CMP Devices	Chair: Brian Skromme, Arizona State Univ., skromme@asu.edu
Process Integration & Reliability	Chair: Vijay Reddy, Texas Instruments, vreddy@ti.com
MEMS	Chair: Ingrid DeWolf, IMEC, dewolfi@imec.be
High Voltage Devices	Chair: Prasad Chaparala, NSC, Prasad.Chaparala@ncs.com
Latchup	Chair: Steve Voldman, IBM, a108501@us.ibm.com

References to previous year's TPC pages - 2004, 2003, 2002, or 2001