International Reliability Physics Symposium

42^nd Annual • April 25 – 29, 2004 • Hyatt Regency Phoenix at Civic Plaza • Phoenix, Arizona

IRPS Technical Program Chair Home Page

Platform Papers Poster Papers 2004 IRPS Call for Papers and Call for Posters pdf	Technical Program Chair Contact Information: Carole D. Graas IBM 1000 River Rd. Mail Stop 967 Essex Junction, VT 05452, USA phone: (802) 769-1214 Fax: (802) 769-4139 email: graas@us.ibm.com email for paper/poster submissions: was set to technical.chair@irps.org
Authors Checklist: Submission template click and save to disk Submission deadline: October 24, 2003 (222 submissions received, 103 platform papers and 60 posters accepted) Late Paper Submission Deadline: December 19, 2003 Acceptance Decision Letter Notification mailed November 24-26 except for late paper submissions Accepted Submissions sent email or fax notification on or shortly after November 20 Detailed submission --> guidelines FAQ 1Bounced email FAQ 2 Fax acknowledgement figures	Detailed Author Kit for Platform and Poster Presenters some of the following are highlights from the authorkit: Submission Timeline IEEE copyright form Acrobat version right click to download Mentor feedback (if requested) no later than Feb. 9 All camera-ready papers/posters publishing deadline: Feb. 23, 2004 Submit electronic presentation (Powerpoint) to Session Chair by March 18, 2004 Submit FINAL electronic presentation to Session Chair by March 31, 2004

The IRPS Technical Program committee is composed of experts in the field of reliability engineering and physics from industry, academia and government labs. The Program Committee is divided into sub-committees that review papers in specific submission categories. This year the sub-committees are:

Vice Chair Technical Program Committee Prasad Chaparala, National Semiconductor
Year-In-Review Seminar:	Chair: Richard Blish, AMD
Device Dielectrics	Chair: Masaaki Niwa, Panasonic/IMEC Vice-Chair: M. Alam, Agere Systems
Back End of Line Dielectrics	Chair: Michael Dion, Intersil Corp. Vice-Chair: James Walls, Motorola
Interconnects	Chair: Paul Ho, Univ. Texas Austin Vice-Chair: Ennis Ogawa, Texas Instruments
Silicon Transistors	Chair: Giuseppe La Rosa, IBM Vice-Chair: Amr Haggag, Motorola
Wide Bandgap/Compound Devices	Chair: Robert Okojie, NASA Vice-Chair: Brian Skromme, Arizona State Univ.
Process Integration	Chair: Jeff Peterson, Intel/SEMATECH, Vice-Chair: Vijay Reddy, Texas Instruments
Electrostatic Discharge & Latchup	Chair: Steve Voldman, IBM Vice-Chair: Gianluca Boselli, Texas Instruments
SER/SEU	Chair: Robert Baumann, Texas Instruments Vice Chair: Norbert Seifert, Intel
Circuits and Products	Chair: Bill Abadeer, IBM Vice-Chair: Andreas Preussger, Infineon
Memories	Chair: Guoqiao Tao, Philips Semiconductor Vice-Chair: Neal Mielke, Intel
MEMs	Chair: Ingrid DeWolf, IMEC
Assembly and Packaging	Chair: Jeff Coffin, IBM Vice Chair: Mauro Ciappa, Swiss Federal Inst.of Technology
Failure Analysis	Chair: Scott Wills, Texas Instruments Vice-Chair: Alan Street, Qualcomm

IRPS Technical Program Chair Home Page

Authors Checklist: