41^st Annual • March 30 – April 4, 2003 • Hyatt Regency Dallas • Dallas, Texas

Author Kit for Platform and Poster Presenters	Technical Program Chair Contact Information: Timothy A. Rost Texas Instruments, MS 3737 13560 N. Central Expressway Dallas, TX 75243 USA phone: (972) 995-9035 Fax: (972) 995-5013 email: t-rost@ti.com email for paper/poster submissions: Tim_Rost@irps.org
Authors Checklist: Submission template click and save to disk Submission/Acceptance Timeline Submission deadline: October 1, 2002 (over 170 submissions) Late Paper Submission Deadline: December 10, 2002 Acceptance Decision Letter Notification mailed October 30, 2002 (81 platform; 25 posters mailed) except for late paper submissions Accepted Submissions sent email notification on or shortly after Oct. 30th (in-process) Mentor feedback (if requested) no later than January 15, 2003 All camera-ready papers/posters publishing deadline: January 27, 2003 Submit electronic presentation to Mentor by February 20, 2003 Submit FINAL electronic presentation to Mentor by March1, 2003. IEEE copyright form Acrobat version right click to download Detailed submission guidelines FAQ	2003 IRPS Call for Papers and Call for Posters   pdf

The IRPS Technical Program committee is composed of experts in the field of reliability engineering and physics from industry, academia and government labs. The Program Committee is divided into sub-committees that review papers in specific submission categories. This year the sub-committees are:

Vice Chair Technical Program Committee Antonietta Oliva Sun Microsystems, Inc.
ESD	Chair: Steve Voldman, IBM Vice Chair: Patrick Juliano, Hewlett-Packard
Failure Analysis	Co-Chair: David Su, TSMC Co-Chair: Scott Wills, TI
Product	Chair: Carole Graas, IBM Vice Chair: Nick Lycoudes, Motorola
Dielectric	Chair: Jim Stathis, IBM Vice Chair: Masaaki Niwa, Matsushita
Memory	Chair: Domokos Hadnagy, Ramtron Vice Chair: Guoqiao Tao, Philips
Circuit	Chair: Steve Walstra, Intel Vice Chair: TBD
SER	Chair: Robert Baumann, TI Vice Chair: TBD
Transistor	Chair: Mohsen Alavi, Intel Vice Chair: Giuseppe LaRosa, IBM
Interconnects	Chair: Jim Lloyd, IBM Vice Chair: Jim Walls, Motorola
Device and Process	Chair: Vijay Reddy, Texas Instruments Vice Chair: Jeff Peterson, Intel
MEMS	Chair: Danelle Tanner, Sandia Vice Chair: Mike Douglass, TI
Compound Semiconductor	Chair: Peter Ersland, AM/COM Vice Chair: Frank Gao, Skyworks Solutions, Inc.
Assembly & Packaging	Chair: Michelle Rasco, SEMATECH Vice Chair: S. Sidharth, AMD
LKD: BEOL Dielectrics	Chair: Jim Walls, Motorola Vice Chair: Mike Dion, Intersil

References to previous year's TPC pages - 2002 or 2001